POWER SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE USING SAME, AND METHOD FOR MANUFACTURING POWER CONVERSION DEVICE

Title:

POWER SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE USING SAME, AND METHOD FOR MANUFACTURING POWER CONVERSION DEVICE

Document Type and Number:

WIPO Patent Application WO/2017/195283

Kind Code:

A1

Abstract:

Provided is a small power conversion device having excellent liquid-tightness, and high reliability of a terminal connection section. This power conversion device is provided with: a case for housing a power semiconductor; a flow channel forming body that forms a flow channel between the outer surface of the case and the flow channel forming body; a first fixed material in contact with a refrigerant flowing in the flow channel; and a second fixed material, which is in contact with the first fixed material and the flow channel forming body, and which covers a first fixed material portion in the direction of case displacement due to water pressure.

Inventors:

TSUYUNO NOBUTAKE (JP)
KUWANO MORIO (JP)
TOKUYAMA TAKESHI (JP)

Application Number:

PCT/JP2016/063942

Publication Date:

November 16, 2017

Filing Date:

May 11, 2016

Export Citation:

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Assignee:

HITACHI AUTOMOTIVE SYSTEMS LTD (JP)

International Classes:

H01L23/473; H01L25/07; H01L25/18; H05K7/20

Foreign References:

JP2012028595A	2012-02-09
JP2008244379A	2008-10-09