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Patent Searching and Data


Title:
POWER STORAGE DEVICE ELEMENT AND POWER STORAGE DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/001908
Kind Code:
A1
Abstract:
Provided are: a reliable power storage device element comprising a multilayer body that constitutes a power storage element, whereat prescribed areas of prescribed end faces of the multilayer body are equipped with thermally sprayed end face electrodes which have a strong joining force to the multilayer body; and a power storage device. The power storage device element is configured such that the average thickness (x1) of positive-electrode current collectors (1) that are exposed at a positive-electrode drawing out area of the multilayer body (10), and the average thickness (y1) of resin-containing insulation layers (13) that are exposed at the positive-electrode drawing out area satisfy a relationship of 0.2 μm ≤ x1 ≤ 2.0 μm, 10 μm ≤ y1 ≤ 30 μm, and y1 ≥ 15x1 - 5, and the average thickness (x2) of negative-electrode current collectors (2) that are exposed at a negative-electrode drawing out area of the multilayer body (10), and the average thickness (y2) of the resin-containing insulation layers (13) that are exposed at the negative-electrode drawing out area satisfy a relationship of 0.2 μm ≤ x2 ≤ 2.0 μm, 10 μm ≤ y2 ≤ 30 μm, and y2 ≥ 15x2 - 5.

Inventors:
HORIKAWA KEIJI (JP)
HORIGUCHI HIROKI (JP)
EHARA YUKIO (JP)
UEDA YASUHIKO (JP)
HARADA HIROYUKI (JP)
ITAYA MASAHARU (JP)
FUKUDA YASUTAKE (JP)
HAYASHI SHIGEO (JP)
Application Number:
PCT/JP2012/061533
Publication Date:
January 03, 2013
Filing Date:
May 01, 2012
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
HORIKAWA KEIJI (JP)
HORIGUCHI HIROKI (JP)
EHARA YUKIO (JP)
UEDA YASUHIKO (JP)
HARADA HIROYUKI (JP)
ITAYA MASAHARU (JP)
FUKUDA YASUTAKE (JP)
HAYASHI SHIGEO (JP)
International Classes:
H01G9/02; H01M4/64; H01M10/04; H01M50/54
Foreign References:
JP2002352850A2002-12-06
JP2004311073A2004-11-04
JPS63224315A1988-09-19
Attorney, Agent or Firm:
NISHIZAWA, HITOSHI (JP)
Hitoshi Nishizawa (JP)
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Claims: