Technical Field

This disclosure relates generally to detecting faults in semiconductor devices, and has particular, but non-exclusive application to semiconductor devices used to switch high current loads. It further has particular application to the use of semiconductor devices in harsh environments, such as automotive environments, but it is not limited to such use.

Background of the Invention

Nowadays, engine management systems for vehicles, and the Electronic Control Units (ECUs) used in such systems, utilise semiconductor devices such as switches and drivers to control and drive loads and actuators. These are often referred to as "Smartpower" switches. Such devices need to be robust and adapted for use in harsh (e.g. automotive) environments, so as to switch high levels of current safely and reliably. In addition, these devices need to provide protection and safety in the event of a fault occurring on the drive/actuator output. Most of such switches include an over-temperature shutdown in case of the silicon temperature exceeds the maximum junction temperature. This over- temperature event might be caused by a variety of reasons, commonly system faults like overload. Such faults are, for example, commonly caused by short circuits to ground, or overload situations.

There is a need to improve the robustness and reliability of such devices when operating in vehicle ECUs, both in normal use, as well as in any fault mode. Electronic Control Units in engine management systems need to cater for a wide range of vehicles. Furthermore, there is a need in such units to reduce the risk of electrical faults occurring in switching and drive devices. Aspects of the invention are however not restricted to automotive applications, and are applicable to semiconductor switches, power devices and drivers in general. It is an object to provide a method and system which can give a predictive/actual indication or other diagnosis reflecting the condition of the device in real time. It is thus an object to increase the robustness of the device by appropriate monitoring it. Furthermore, it is desirable that any instantaneous or slowly developing faults are detected and dealt with appropriately.

Summary of the Invention

In one aspect of the invention is provided a method of monitoring a semiconductor device which includes a transistor, comprising determining the resistance R _dSO n between the drain and the source of the transistor when the device is in an operative state, and comparing this against an expected value, Rdsonexp and determining that there is a fault as a result of said comparison.

Preferably the method includes the steps of determining the drain-source current, I _ds, flowing through the device transistor, and determining the differential drain-source voltage Vd _s across the transistor. Preferably the value of Rd _SO n is determined by the equation

Rdson ⁼ Vds/Ids

Preferably the temperature T _rea i of the device is measured or estimated and used to determine a value of the expected value Rdsonexp-

The expected value Rdsonexp may be determined by the equation: Rdsonexp = RdsonTx (1 + a (T _rear T _x )) where RdsonTx is the value of the resistance of the power device at a temperature T _x and T _rea i is the temperature of the device.

T _x may be the ambient temperature between 15 and 35° C.

The method may include determining the difference between the actual resistance Rdson and the expected resistance Rdsonexp as a proportion of the expected resistance, and determining there is a fault is this proportion exceeds or equals a threshold value.

If it is determined there is a fault, an alert may be generated or said device switched off.

The semiconductor device may be part of a vehicle management system or vehicle electronic control unit. The device may be a switching device, power device, driver device, or Smartpower device. The transistor may be a MOSFET or other power transistor. Also provided is system adapted to monitor a semiconductor device which includes a transistor, comprising means to determining the resistance Rdson between the drain and the source of the transistor when the device is in an operative state, and means to compare this value against an expected value , Rdsonexp to determine if there is a fault.

One of the main faults which can occur within a vehicle ECU is electro-migration, which can arise when long-term short circuit or current leakage occurs. This phenomenon is related to the transport of metal atoms at the metallization level in semiconductor devices. High current density encourages electro-migration.

Such devices typically include a transistor such as a power transistor, usually a MOSFET having gate, drain and source terminals. Tests performed by the inventors have shown that that electro-migration causes an increase in the value of R _dSOn , that is, the resistance between drain and source of a transistor of a semiconductor device when in an "on" state.

In an aspect of the invention, the value of R _dSOn , and the drift in this value, is monitored. This allows an assessment of the fatigue state and of the extent of electro-migration within the semiconductor device to be determined by monitoring for any immediate or insipid (slowly occurring) fault occurring in the device.

The monitored value of R _dSOn may be compared to an expected value R _dsonex - In operation, if there is an unreasonable discrepancy between the actual and the expected value, it may be assumed that a fault has developed. In the event, an alert may be generated; alternatively the device may be switched off.

Brief Description of the Drawings

The present invention will now be described, by way of example, with reference to the accompanying drawings, in which:

Figure 1 shows a schematic circuit diagram of an Electronic Control Unit incorporating an example of the invention.

Description of the Preferred Embodiments

Fig. 1 is a schematic circuit diagram of an Electronic Control Unit 1 for a vehicle. This includes a microcontroller 2 whose function is to process data and provide an output to one or more drives, loads or actuators 3. The microcontroller is connected to a power device 4 such as a Smartpower device which includes a transistor 5 such as a power transistor e.g. a MOSFET. The power transistor includes three terminals source, drain and gate. The microcontroller and power device are connected to a power supply block 8 which provides both with a source of power. An amplifier 9 is provided which is an additional block and is a measurement amplifier that is used to measure the differential voltage across the drain and source terminals of the 'Smartpower" device. The amplifier input impedance is of high impedance (a few MOhm) The power device includes means 10 to measure the drain-source current that flows through the transistor. In a preferred example, such as that shown in the figure, the device also includes temperature measurement means 11 to measure the temperature of the device.

According to an example, a method determines the value of Rd _SO n, that is the resistance between the drain and the source of the device transistor when it is in an "on" state. This is determined in one example by measuring the following two variables: i) Ids, that is, the drain-source current that flows in the device transistor. This can be measured by the use of a measurement block integrated within the device.

ii) Vds, that is, the drain to source voltage. Vds can be determined from the use of a measurement block (e.g. amplifier 9) located within the ECU to measure the differential across the power transistor of the (e.g. Smartpower) device driver. As the power MOSFET is integrated within the (Smartpower) device, one way to measure the drain-source voltage of the transistor is to measure the voltage across the (Smartpower) device package pins (drain pin, source pin). The drain and source terminals of the MOSFETs are typically connected to the (Smartpower) device pins by the use of bonding (the transistor drain is soldered on the device leadframe and the transistor source is connected to the device (Smarpower) pin by the use of wire/leadframe bonding.

The value of Rd _SO n can be determined by the equation Vd _s /Ids- This value is then compared with an expected value Rdsonex, to detect if there is a fault developing, or has developed, in the device. This value (Rdsonex) can be stored in the system.

It would be clear to the skilled reader that there may be a variety of different ways in which a developing fault may be assumed to exist. If there is a large enough discrepancy between Rd _SO n and Rdsonex, one can assume that a fault has developed. One particular way of doing this is to see how much proportionally R _ds0 n has altered (e.g. increased) from Rdsonex.. Thus, in an example, the following equation may be used to determine if a fault needs to be flagged:

% increase in discrepancy = (Rdson - Rdsonex)/ Rdsonex,

If this increase is greater than a threshold, which may be stored, a fault may be assumed.

In a preferred example, the temperature of the device is also taken into account. Even without any fault, the value of Rd _SO n will change with device temperature. In a preferred example, the value of Treai, the device temperature is measured buy a suitable temperature measurement block located with the device, i.e. integrated within it. The measured (or estimated temperature) is then used to adjust the expected value Rdsonex, to which R _ds0 n is compared. In one example, expected value of R _dsonex is adjusted according to the following equation:

Rdsonex ⁼ Rdson25 (1 + Ct (T _rea r25)) where R _dSO n25 is the value of the resistance between drain and source of the device transistor at a temperature of 25°C, and a is some constant. Of course it is to be understood that not just 25°C, but any suitable ambient temperature may be used for this purpose, and the equation amended correspondingly.

The value R _dSO n25 can be determined during an initial calibration process, for example during a final test step during assembly. This value can be stored as a reference value within the ECU.

The above description is considered that of the preferred embodiments only. Modifications of the invention will occur to those skilled in the art and to those who make or use the invention. Therefore, it is understood that the embodiments shown in the drawings and described above are merely for illustrative purposes and not intended to limit the scope of the invention, which is defined by the following claims as interpreted according to the principles of patent law, including the doctrine of equivalents.