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Patent Searching and Data


Title:
POWER SYSTEM
Document Type and Number:
WIPO Patent Application WO/2020/171348
Kind Code:
A1
Abstract:
A power system according to various embodiments is provided. The power system comprises a motherboard and a plurality of power modules that can be sequentially stacked on the motherboard. The motherboard comprises a motherboard substrate and a power pin on the motherboard substrate and is configured to supply main power through the power pin. The plurality of power modules comprises: a first power module which comprises a first module substrate and a first through power pin penetrating the first module substrate and which is stacked on the motherboard so as to convert and output first power from the main power when the first through power pin is connected to the power pin of the motherboard; and a second power module which comprises a second module substrate and a second through power pin penetrating the second module substrate, and which is stacked on the first power module so as to convert and output second power from the main power when the second through power pin is connected to the first through power pin of the first power module.

Inventors:
SEO JOON HO (KR)
KIM MIN SU (KR)
Application Number:
PCT/KR2019/015597
Publication Date:
August 27, 2020
Filing Date:
November 15, 2019
Export Citation:
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Assignee:
NAVER LABS CORP (KR)
International Classes:
H02M7/00; H02M7/04
Foreign References:
KR101621076B12016-05-13
KR20020025766A2002-04-04
KR20180080468A2018-07-12
KR20160146940A2016-12-21
JP2016195506A2016-11-17
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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