Title:
POWER WIRING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/238171
Kind Code:
A1
Abstract:
The present invention provides a power wiring structure including a conductive line (4) through which a current is passed, an insulator (11) covering the conductive line (4), a conductor (5) covering the insulator (11), and a magnetic substance (12) disposed on a surface of the conductor (5).
Inventors:
HIGUCHI HIRONOBU (JP)
Application Number:
PCT/JP2022/022711
Publication Date:
December 14, 2023
Filing Date:
June 06, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/36; H01B5/02; H05K7/20
Foreign References:
| JPH1153956A | 1999-02-26 | |||
| JP2004281181A | 2004-10-07 | |||
| JPH1092988A | 1998-04-10 | |||
| JP2009158658A | 2009-07-16 |
Attorney, Agent or Firm:
PALMO PATENT FIRM, P.C. (JP)
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