PRDUCTION METHOD FOR COPOLYMER FILM, COPOLYMER FILM PRODUCED BY THE FORMING METHOD, AND SEMICONDUCTOR DEVICE USING COPOLYMER FILM

WIPO Patent Application WO/2003/002629

A1

A production method for an organic polymer film having a high adhesiveness at the interface with other semiconductor materials in contact with the upper and lower surfaces thereof when used as an interlayer insulation film constituting a semiconductor device, and being able to be further reduced in an effective relative permittivity throughout the entire film. Specifically, a plurality of evaporated organic monomers are sprayed onto a heated substrate surface via plasma produced in an reaction chamber to form a copolymer film containing a plurality of organic monomers as a skeleton. During forming the film, the relative supply amounts of respective organic monomers are changed to thereby continuously grow, in the vicinity of interfaces (91a, c, 92a, c and 93a, c), an interlayer insulation film having low−bulk−density films disposed in intermediate layers (91b, 92b, 93b) sandwiched by siloxane structure−rich films rich in mechanical strength and adhesiveness.

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HAYASHI YOSHIHIRO (JP)
KAWAHARA JUN (JP)

PCT/JP2002/006639

January 09, 2003

July 01, 2002

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NEC CORP (JP)
HAYASHI YOSHIHIRO (JP)
KAWAHARA JUN (JP)

C08G61/12; C09D4/00; C23C14/12; C23C16/505; H01L21/312; H01L21/768; (IPC1-7): C08G61/12; H01L21/312

GB2343453A

2000-05-10

Kaneda, Nobuyuki (16th Kowa Building 9-20 Akasaka 1-chome Minato-ku, Tokyo, JP)

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