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Title:
PRECURSOR FILM, SUBSTRATE WITH PLATED LAYER, CONDUCTIVE FILM, TOUCH PANEL SENSOR, TOUCH PANEL, CONDUCTIVE FILM MANUFACTURING METHOD, AND COMPOSITION FOR FORMING PLATED LAYER
Document Type and Number:
WIPO Patent Application WO/2019/187644
Kind Code:
A1
Abstract:
A precursor film for manufacturing a conductive film is provided which includes a substrate and a plated layer precursor layer arranged on the substrate, wherein the plated layer precursor layer includes a multifunctional monomer, a monofunctional monomer, and a polymer having a polymerizable functional group and a functional group which interacts with a plating catalyst or a precursor thereof.

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Inventors:
NARITA TAKESHI (JP)
Application Number:
PCT/JP2019/003930
Publication Date:
October 03, 2019
Filing Date:
February 05, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C23C18/18; C08F279/02; C23C18/31; G06F3/041
Domestic Patent References:
WO2006080178A12006-08-03
WO2018034291A12018-02-22
WO2016159136A12016-10-06
Foreign References:
JP2012214872A2012-11-08
JP2017057280A2017-03-23
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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