Title:
PREFORM SOLDER AND SOLDER-BOUND BODY FORMED USING SAID PREFORM SOLDER
Document Type and Number:
WIPO Patent Application WO/2021/020309
Kind Code:
A1
Abstract:
This preform solder contains a lead-free solder containing Sn as a main component, and metal particles having a melting point higher than that of the lead-free solder, wherein the metal particles are formed of a Cu-Ni alloy having a Ni content of 0.1-90 mass% or a Cu-Co alloy having a Co content of 0.1-90 mass%, the lead-free solder may contain Ni in the case where the metal particles are formed of the Cu-Ni alloy, the lead-free solder contains Ni in the case where the metal particles are formed of the Cu-Co alloy, and (Cu, Ni)6Sn5 is formed on the surface of the metal particles. This preform solder can be used to form a solder-bound part having excellent heat resistance, thermal conductivity, and reliability superior to those of conventional products.
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Inventors:
NISHIMURA TETSURO (JP)
Application Number:
PCT/JP2020/028578
Publication Date:
February 04, 2021
Filing Date:
July 22, 2020
Export Citation:
Assignee:
NIHON SUPERIOR CO LTD (JP)
International Classes:
B23K35/14; B22F1/00; C22C9/06; C22C19/03
Domestic Patent References:
| WO2017134974A1 | 2017-08-10 | |||
| WO2012066795A1 | 2012-05-24 | |||
| WO2012108395A1 | 2012-08-16 | |||
| WO2003021664A1 | 2003-03-13 |
Foreign References:
| JP5369682B2 | 2013-12-18 | |||
| JP2005161338A | 2005-06-23 | |||
| JP2011041970A | 2011-03-03 |
Attorney, Agent or Firm:
YANAGINO Takao et al. (JP)
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