Title:
PREPARATION METHOD FOR COMPOSITE CURRENT COLLECTOR
Document Type and Number:
WIPO Patent Application WO/2023/142320
Kind Code:
A1
Abstract:
The present invention relates to the technical field of new materials, and in particular to a preparation method for a composite current collector. In the present invention, by performing femtosecond laser etching on a polymer film, a large number of etching holes can be formed on the surface of the polymer film, so that the surface polarity of a non-polar polymer film is improved, a binding force between the non-polar polymer film and a subsequent plated metal layer is enhanced, and an activator in a next step can be better adsorbed, thereby smoothly completing activation. The polymer film is subjected to contact treatment by using the activator having specific composition and concentration, and is treated under ultraviolet light, and due to the laser effect, divalent copper ions in the activator are reduced into elemental copper by H 2PO 2 -, forming a nano-scale copper layer on the surface of the polymer film, so that a certain sheet resistance is achieved, and subsequent chemical plating or electroplating can be performed, thereby replacing physical vapor deposition steps in the prior art of preparing a composite current collector, effectively reducing energy consumption and the production costs, and improving the production efficiency.
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Inventors:
LU JIANDONG (CN)
LI XUEFA (CN)
ZHANG GUOPING (CN)
LI XUEFA (CN)
ZHANG GUOPING (CN)
Application Number:
PCT/CN2022/094820
Publication Date:
August 03, 2023
Filing Date:
May 25, 2022
Export Citation:
Assignee:
JIANGYIN NANOPORE INNOVATIVE MATERIALS TECH LTD (CN)
International Classes:
H01M4/66
Foreign References:
| CN109599563A | 2019-04-09 | |||
| CN107313030A | 2017-11-03 | |||
| CN110943228A | 2020-03-31 | |||
| JP2019026879A | 2019-02-21 |
Other References:
LIHONG ZHANG, TANG GUANGCHAO, CUI KAIFANG: "Electroless copper plating on polyimide thin film after femtosecond laser etching and laser-induced activation", DIAN DU YU TU SHI = ELECTROPLATING & FINISHING, GUANGDONG QINGGONG DIANDU XUEHUI, CN, vol. 39, no. 21, 15 November 2020 (2020-11-15), CN , pages 1477 - 1480, XP093081908, ISSN: 1004-227X, DOI: 10.19289/j.1004-227x.2020.21.006
PAN WANG, CUI KAIFANG; ZHONG LIANG: "Laser-Induced Activation Electroless Copper Plating on Surface of Polyimide Plastics", ELECTROPLATING & POLLUTION CONTROL, vol. 40, no. 3, 30 May 2020 (2020-05-30), pages 30 - 33, XP093081910
PAN WANG, CUI KAIFANG; ZHONG LIANG: "Laser-Induced Activation Electroless Copper Plating on Surface of Polyimide Plastics", ELECTROPLATING & POLLUTION CONTROL, vol. 40, no. 3, 30 May 2020 (2020-05-30), pages 30 - 33, XP093081910
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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