Title:
PREPARATION METHOD OF ENVIRONMENTALLY FRIENDLY PARTICLE BOARD
Document Type and Number:
WIPO Patent Application WO/2011/068286
Kind Code:
A1
Abstract:
The present invention relates to a preparation method of a particle board wherein the particle board comprises a surface layer-a middle layer-a surface layer, a tannin adhesive is coated on the surface layers and an MDI adhesive is coated on the middle layer when the particle board is prepared, thereby decreasing curing time and reducing formaldehyde emission levels to levels of native wood.
Inventors:
LEE JONG SUK (KR)
KWACK IN YOUNG (KR)
WOO YOUNG DO (KR)
SHIN YOON CHEOL (KR)
LEE SI JOON (KR)
JUNG BYUNG JAE (KR)
KWACK IN YOUNG (KR)
WOO YOUNG DO (KR)
SHIN YOON CHEOL (KR)
LEE SI JOON (KR)
JUNG BYUNG JAE (KR)
Application Number:
PCT/KR2010/001904
Publication Date:
June 09, 2011
Filing Date:
March 29, 2010
Export Citation:
Assignee:
DONG WHA CO LTD (KR)
DONGWHA HOLDINGS CO LTD (KR)
DONGWHA GREENCHEM CO LTD (KR)
LEE JONG SUK (KR)
KWACK IN YOUNG (KR)
WOO YOUNG DO (KR)
SHIN YOON CHEOL (KR)
LEE SI JOON (KR)
JUNG BYUNG JAE (KR)
DONGWHA HOLDINGS CO LTD (KR)
DONGWHA GREENCHEM CO LTD (KR)
LEE JONG SUK (KR)
KWACK IN YOUNG (KR)
WOO YOUNG DO (KR)
SHIN YOON CHEOL (KR)
LEE SI JOON (KR)
JUNG BYUNG JAE (KR)
International Classes:
B27N3/02; B27N3/08
Foreign References:
| KR100666772B1 | 2007-01-09 | |||
| KR100666772B1 | 2007-01-09 | |||
| JP2003025310A | 2003-01-29 | |||
| JP2008087372A | 2008-04-17 | |||
| US20010017427A1 | 2001-08-30 |
Attorney, Agent or Firm:
OH, Seung-Keon (KR)
오승건 (KR)
오승건 (KR)
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