Title:
PREPARATION METHOD FOR METAL POWDER CORE INTEGRATED CHIP INDUCTOR
Document Type and Number:
WIPO Patent Application WO/2022/165992
Kind Code:
A1
Abstract:
Provided in the present invention is a preparation method for a metal powder core integrated chip inductor, comprising the following steps: coil winding, compression moulding, chamfering, curing, insulation coating, grinding, and electroplating. The integrated chip inductor of the present invention iterates the technology of paste-terminated electroplating type integrated inductors, copper sheet-terminated electrode type integrated inductors, and built-in T-shape magnetic core leaf pendulum upper winding electrode type products in the current industry, and thereby reduces the mounting size of the product on the circuit board and increases the mounting space of the integrated circuit PCB; the present invention can achieve smart manufacturing and implement resource saving and environmental friendliness, and can create unique value for the development of the world electronics industry.
Inventors:
SU LILIANG (CN)
SONG SHUHUA (CN)
SU LIFENG (CN)
LIU YU (CN)
SU XUEYUAN (CN)
LIN CHUIPAN (CN)
CHEN SHE (CN)
SONG SHUHUA (CN)
SU LIFENG (CN)
LIU YU (CN)
SU XUEYUAN (CN)
LIN CHUIPAN (CN)
CHEN SHE (CN)
Application Number:
PCT/CN2021/087837
Publication Date:
August 11, 2022
Filing Date:
April 16, 2021
Export Citation:
Assignee:
CYGE ELECTRONIC TECH HUNAN CO LTD (CN)
International Classes:
H01F17/04; H01F27/28; H01F41/00; H01F41/02
Foreign References:
| CN109961922A | 2019-07-02 | |||
| CN110565134A | 2019-12-13 | |||
| CN110098042A | 2019-08-06 | |||
| CN108735433A | 2018-11-02 | |||
| CN102856067A | 2013-01-02 | |||
| US20090250836A1 | 2009-10-08 |
Attorney, Agent or Firm:
GUANGZHOU CHUANMO INTELLECTUAL PROPERTY LAW FIRM (CN)
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