PREPREG FOR PRINTED WIRING BOARD AND COPPER-CLAD LAMINATED BOARD

Title:

PREPREG FOR PRINTED WIRING BOARD AND COPPER-CLAD LAMINATED BOARD

Document Type and Number:

WIPO Patent Application WO/2004/110115

Kind Code:

A1

Abstract:

A prepreg for printed wiring board characterized by using a brominated epoxy resin such that the peak intensity measured by an absorption spectrophotometer, at a wave number of 2100 to 2300 cm^-1 of the infrared absorption spectrum is 5% or less of the peak intensity, measured similarly, of the benzene ring C=C bond near a wave number of 1600 cm^-1, and that the point of inflection of the cured brominated epoxy resin is 120 to 150°C when measured by means of a differential scanning calorimetric analyzer. The prepreg for printed wiring board is excellent in hygroscopicity, heat-resistance, and desmearability as a printed wiring board material. A copper-clad laminated board using this is also disclosed.

Inventors:

ITOU KATSUHIKO (JP)
HIBINO AKINORI (JP)
MOTOBE HIDETSUGU (JP)

Application Number:

PCT/JP2003/006964

Publication Date:

December 16, 2004

Filing Date:

June 02, 2003

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC WORKS LTD (JP)
ITOU KATSUHIKO (JP)
HIBINO AKINORI (JP)
MOTOBE HIDETSUGU (JP)

International Classes:

B32B15/08; H05K1/03; (IPC1-7): H05K1/03; C08J5/24; B32B15/08

Foreign References:

JP2002080559A	2002-03-19
JP2001081203A	2001-03-27
JP2000068617A	2000-03-03
JPH0812858A	1996-01-16
JPH0780994A	1995-03-28

Other References: