PREPREG, SUBSTRATE, PRINTED CIRCUIT BOARD AND RELATED PREPARATION METHOD

WIPO Patent Application WO/2024/021897

A1

The present application provides a prepreg, a substrate, a printed circuit board and a related preparation method. The prepreg comprises a semi-cured resin and a reinforcing material. The reinforcing material comprises a fiber cloth. The fiber cloth comprises LCP fiber filament. The LCP fiber filament has a dielectric constant of 2.5-4.5 and a dielectric loss factor of less than 0.005@10GHz. In the present application, since the LCP fiber filament has a dielectric constant of 2.5-4.5, which is close to the dielectric constant of a resin material, the problem of delay skew can be minimized. Furthermore, the LCP fiber filament has a dielectric loss factor of less than 0.005@10GHz, which is lower than the dielectric loss factor of a conventional inorganic glass fiber cloth, such that the cost thereof is lower than that of the inorganic glass fiber cloth having the low dielectric loss factor. Accordingly, the prepreg of the present application may have excellent dielectric properties on the basis of ensuring low costs, and can fully meet the application requirements of high-frequency and high-speed electronic products.

CHEN HAO (CN)
DING LIBIN (CN)

PCT/CN2023/099046

February 01, 2024

June 08, 2023

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HUAWEI TECH CO LTD (CN)

B32B27/02; B32B27/06; B32B27/12; B32B27/36; B32B37/10; B32B38/08; H05K1/02; H05K1/03; H05K1/09; H05K3/02

CN116638836A	2023-08-25
CN219164807U	2023-06-09
CN116039186A	2023-05-02
US20120315814A1	2012-12-13
CN101081903A	2007-12-05
CN102070854A	2011-05-25
CN102115569A	2011-07-06
CN111849098A	2020-10-30
CN214056752U	2021-08-27
JP2005060635A	2005-03-10
TW201124478A	2011-07-16

TDIP & PARTNERS (CN)

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