Title:
PRESS HEAD, PRESS APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS, AND ELECTRONIC COMPONENT MANUFACTURING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/062921
Kind Code:
A1
Abstract:
This press head is provided with a head body and a sheet portion. The head body has a press surface. The sheet portion faces the press surface and is fixed so as to have a gap with respect to the press surface. Further, the sheet portion has a flexible layer opposed to the press surface and a release layer formed so as to contact the flexible layer.
Inventors:
HIRAO TAKAHIRO (JP)
SHIROEDA YOSHIHIRO (JP)
BOONRUANGKARD WASAN (JP)
WIKANAIZ PRUSAPA (TH)
WONGBOONTAN MANUPHONG (TH)
THAMRONGTHANAKIAT THANAKORN (TH)
SHIROEDA YOSHIHIRO (JP)
BOONRUANGKARD WASAN (JP)
WIKANAIZ PRUSAPA (TH)
WONGBOONTAN MANUPHONG (TH)
THAMRONGTHANAKIAT THANAKORN (TH)
Application Number:
PCT/JP2023/032475
Publication Date:
March 28, 2024
Filing Date:
September 06, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L21/52; H05K13/04
Foreign References:
| JP2017120835A | 2017-07-06 | |||
| JP2004335627A | 2004-11-25 | |||
| JP2010016070A | 2010-01-21 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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