Title:
PRESSING DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/039427
Kind Code:
A1
Abstract:
This pressing device is for pressing two main surfaces of a stacked substrate comprising a first substrate and a second substrate bonded to the first substrate, and comprises: a retention part for retaining the stacked substrate; a movable part disposed to face the retention part; a pressure application mechanism which moves the movable part and causes the movable part to press the stacked substrate against the retention part, wherein the movable part has a pressing surface that presses the entirety of one main surface of the stacked substrate, and the retention part has a retaining surface on which the entirety of the other main surface of the stacked substrate is retained.
Inventors:
SUGIHARA SHINTARO (JP)
WADA NORIO (JP)
MANABE EIJI (JP)
WADA NORIO (JP)
MANABE EIJI (JP)
Application Number:
PCT/JP2020/030809
Publication Date:
March 04, 2021
Filing Date:
August 13, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B23K20/00; H01L21/02; H01L21/683
Foreign References:
| JP2016134419A | 2016-07-25 | |||
| JP2013149725A | 2013-08-01 | |||
| JPH1187203A | 1999-03-30 | |||
| JP2009535823A | 2009-10-01 | |||
| JP2015228449A | 2015-12-17 | |||
| JP2018190826A | 2018-11-29 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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