Title:
PRESSURE BONDING-TYPE ADHESIVE MEMBER
Document Type and Number:
WIPO Patent Application WO/2018/043757
Kind Code:
A1
Abstract:
Provided is a pressure bonding-type adhesive member comprising a support body 1, a first adhesive layer 2 formed on one surface of the support body 1, and a second adhesive layer 3 formed on the other surface of the support body 1. The pressure bonding-type adhesive member is characterized in that the second adhesive layer 3 comprises a main body layer 3A and a plurality of protrusions 3B provided on the surface of the main body layer 3A, and in that the adhesive strength of the second adhesive layer 3 is greater than the adhesive strength of the first adhesive layer 2.
Inventors:
DOI ASAMI (JP)
TAKAHASHI AKIKO (JP)
CHIBA MIZUHO (JP)
SHIMOKITA KEISUKE (JP)
OOTAKE HIRONAO (JP)
TAKAHASHI AKIKO (JP)
CHIBA MIZUHO (JP)
SHIMOKITA KEISUKE (JP)
OOTAKE HIRONAO (JP)
Application Number:
PCT/JP2017/031986
Publication Date:
March 08, 2018
Filing Date:
September 05, 2017
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J5/00; C09J121/00; C09J133/04; C09J183/04; E04F13/07
Domestic Patent References:
| WO2016143731A1 | 2016-09-15 | |||
| WO2017065275A1 | 2017-04-20 |
Foreign References:
| JPS4942167U | 1974-04-13 | |||
| JP2002121503A | 2002-04-26 | |||
| JPH09227843A | 1997-09-02 |
Other References:
See also references of EP 3508544A4
Attorney, Agent or Firm:
TAKASHIMA, Hajime et al. (JP)
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