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Patent Searching and Data


Title:
PRESSURE CONTROL METHOD AND APPARATUS, AND SEMICONDUCTOR PROCESS DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/231914
Kind Code:
A1
Abstract:
A pressure control method and apparatus, and a semiconductor process device. The method comprises: acquiring, in real time, an actual pressure value in a process chamber (S1); calculating a pressure variation of the actual pressure value (S2); and comparing the pressure variation with a preset value, which is set in advance, controlling an actuator of a pressure regulating valve to maintain the current frequency when the pressure variation is less than or equal to the preset value, and reducing the frequency of the actuator according to a preset function relationship when the pressure variation is greater than the preset value, until the actual pressure value reaches a target pressure value (S3), and controlling a change in the openness of the pressure regulating valve on the basis of the frequency. By using the method, the problem of pressure overshoot during rapid control of a chamber pressure is solved, thereby reducing the influence of pressure fluctuations on a process.

Inventors:
ZHENG WENNING (CN)
ZHAO DI (CN)
DU CHUANZHENG (CN)
Application Number:
PCT/CN2023/096498
Publication Date:
December 07, 2023
Filing Date:
May 26, 2023
Export Citation:
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Assignee:
BEIJING SEVENSTAR FLOW CO LTD (CN)
International Classes:
G05D16/20; H01L21/67
Foreign References:
CN115145319A2022-10-04
CN111831022A2020-10-27
CN112467176A2021-03-09
CN113604840A2021-11-05
US20190196516A12019-06-27
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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