Title:
PRESSURE MEASUREMENT MECHANISM AND BREAKING DEVICE PROVIDED WITH SAID PRESSURE MEASUREMENT MECHANISM
Document Type and Number:
WIPO Patent Application WO/2020/110459
Kind Code:
A1
Abstract:
Provided are a pressure measurement mechanism and a breaking device that can perform load measurement on a substrate with high accuracy and prevent damage on a load cell even if an abnormal load is applied to a blade in pressure measurement during breaking of the substrate. The present invention provides a pressure measurement mechanism (12) of a breaking device (1) comprising a blade unit (2) that breaks a substrate (19) with a blade (3) and a driving unit (4) that lowers the blade unit (2). The pressure measurement mechanism (12) has an upper sliding member (14) that moves vertically, a lower sliding member (15) that is arranged under the upper sliding member (14) and moves the blade unit (2) vertically, a measurement unit (13) that is pressed by the lower sliding member (15) and measures a reactive force acting on the blade (3), and a retaining member (16) that retains the measurement unit (13) and is coupled to the upper sliding member (14). A previously-compressed spring (17) is held between the upper sliding member (14) and the lower sliding member (15).
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Inventors:
OKUDA OSAMU (JP)
KANEHIRA YUICHI (JP)
KANEHIRA YUICHI (JP)
Application Number:
PCT/JP2019/039087
Publication Date:
June 04, 2020
Filing Date:
October 03, 2019
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
International Classes:
B28D5/00; B26F3/00; C03B33/033
Domestic Patent References:
WO2008126502A1 | 2008-10-23 |
Foreign References:
JP2013038434A | 2013-02-21 | |||
JP2001319899A | 2001-11-16 | |||
JP2013144635A | 2013-07-25 | |||
JP2013216546A | 2013-10-24 | |||
JP2009107897A | 2009-05-21 |
Attorney, Agent or Firm:
YASUDA MIKIO (JP)
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