Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, LAMINATE, AND IMAGE DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/071328
Kind Code:
A1
Abstract:
Provided is a pressure-sensitive adhesive composition which gives pressure-sensitive adhesive layers having a low modulus and has excellent pressure-sensitive adhesiveness to substrates such as optical films. The pressure-sensitive adhesive composition comprises: a bifunctional oligomer which includes a polyoxyalkylene chain and urethane-bond-containing groups derived from an isocyanate-group-containing compound and has two (meth)acryloyloxy groups in the molecule, and which has a urethane bond content in the molecule of 3.90-6.00 mass%; and a monofunctional oligomer which includes a polyoxyalkylene chain and urethane-bond-containing groups derived from an isocyanate-group-containing compound and has one (meth)acryloyloxy group in the molecule. The pressure-sensitive adhesive composition has a total content of the bifunctional oligomer and the monofunctional oligomer of 40 mass% or higher.
Inventors:
NAKAMURA MAKITO (JP)
KIKUKAWA NAOYA (JP)
SUZUKI CHITOSHI (JP)
KIKUKAWA NAOYA (JP)
SUZUKI CHITOSHI (JP)
Application Number:
PCT/JP2019/038587
Publication Date:
April 09, 2020
Filing Date:
September 30, 2019
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C09J175/16; B32B27/00; C09J7/38; G09F9/00
Domestic Patent References:
| WO2015159957A1 | 2015-10-22 | |||
| WO2017179899A2 | 2017-10-19 |
Foreign References:
| JP2012144726A | 2012-08-02 | |||
| JP2009274256A | 2009-11-26 |
Attorney, Agent or Firm:
T.S. PARTNERS et al. (JP)
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