Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PROCESS FOR MANUFACTURING PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2015/079905
Kind Code:
A1
Abstract:
Provided are: a pressure-sensitive adhesive composition which exhibits excellent constant-load-bearing properties and so on even in a case where the amount of a curing catalyst blended is small or even in a case where no curing catalyst is blended; and a process for manufacturing a pressure-sensitive adhesive sheet using said pressure-sensitive adhesive composition. A pressure-sensitive adhesive composition which comprises a silyl -terminated polymer (A), a (meth)acrylic ester copolymer (B), and a tackifier resin (C), and a pressure-sensitive adhesive sheet using said pressure-sensitive adhesive composition, wherein: the silyl-terminated polymer (A) is a silyl-terminated polymer having a prescribed structure; the (meth)acrylic ester copolymer (B) contains copolymerized units derived from a carboxyl-containing vinyl monomer; and the amount of a curing catalyst (D) blended is 0 to 0.1wt% relative to the total amount of the components (A) to (C).
Inventors:
YAMAGUCHI SEITARO (JP)
OTAKA SYO (JP)
MIYATA SOU (JP)
OTAKA SYO (JP)
MIYATA SOU (JP)
Application Number:
PCT/JP2014/079847
Publication Date:
June 04, 2015
Filing Date:
November 11, 2014
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J171/02; B32B27/00; B32B27/30; C09J7/22; C09J7/38; C09J11/06; C09J11/08; C09J133/02; C09J175/08
Foreign References:
| JP2013221079A | 2013-10-28 | |||
| JP2013235153A | 2013-11-21 | |||
| JP2008239809A | 2008-10-09 | |||
| JPH04145188A | 1992-05-19 |
Attorney, Agent or Firm:
EMORI Kenji et al. (JP)
Kenji Emori (JP)
Kenji Emori (JP)
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