Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE, AND PRESSURE-SENSITIVE ADHESIVE SHEET USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/077613
Kind Code:
A1
Abstract:
Provided is a pressure-sensitive adhesive having a high adhesive strength and a high cohesive strength, which is cured by active energy ray irradiation. The present invention relates to a pressure-sensitive adhesive composition comprising: an acrylic resin (A); an ethylenically unsaturated compound containing one ethylenically unsaturated group (B); an ethylenically unsaturated compound containing two or more ethylenically unsaturated groups (C); and a photoinitiator (D). The pressure-sensitive adhesive composition is characterized by comprising an ethylenically unsaturated compound containing an alicyclic structure (B1) and a hydroxyl group-containing ethylenically unsaturated compound (B2) as the ethylenically unsaturated compound containing one ethylenically unsaturated group (B).
Inventors:
KANDA KOUSOU
Application Number:
PCT/JP2011/077993
Publication Date:
June 14, 2012
Filing Date:
December 02, 2011
Export Citation:
Assignee:
NIPPON SYNTHETIC CHEM IND (JP)
KANDA KOUSOU
KANDA KOUSOU
International Classes:
C09J4/02; C09J7/02; C09J133/00
Foreign References:
| JPH1161081A | 1999-03-05 | |||
| JP2008248103A | 2008-10-16 | |||
| JP2010195942A | 2010-09-09 | |||
| JPS63284213A | 1988-11-21 | |||
| JPH0657216A | 1994-03-01 | |||
| JP2003268335A | 2003-09-25 | |||
| JP2007246882A | 2007-09-27 | |||
| JP2011225835A | 2011-11-10 | |||
| JP2011099078A | 2011-05-19 |
Attorney, Agent or Firm:
NAITO TERUO (JP)
Teruo Naito (JP)
Teruo Naito (JP)
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Claims: