Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2022/270565
Kind Code:
A1
Abstract:
The present invention provides a pressure-sensitive adhesive composition which is less apt to corrode metals and can exhibit excellent adhesive force. Also provided is a pressure-sensitive adhesive tape including a pressure-sensitive adhesive layer comprising the pressure-sensitive adhesive composition. This pressure-sensitive adhesive composition includes an acrylic copolymer comprising 50 wt% or more constituent unit derived from n-heptyl (meth)acrylate, and has an acid value of 22 mgKOH/g or less and a 23°C shear storage modulus of 6×104 to 5×105 Pa.
Inventors:
ADACHI AYA (JP)
OGATA YUDAI (JP)
KOGISO TATSUYA (JP)
UCHIDA NORIYUKI (JP)
KATAOKA HIROYUKI (JP)
YAMAMOTO HIROKI (JP)
OGATA YUDAI (JP)
KOGISO TATSUYA (JP)
UCHIDA NORIYUKI (JP)
KATAOKA HIROYUKI (JP)
YAMAMOTO HIROKI (JP)
Application Number:
PCT/JP2022/025002
Publication Date:
December 29, 2022
Filing Date:
June 23, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J133/04; C09J7/38; C09J11/08
Domestic Patent References:
| WO2019244595A1 | 2019-12-26 | |||
| WO2013005470A1 | 2013-01-10 |
Foreign References:
| JP2020164844A | 2020-10-08 | |||
| EP2626397A1 | 2013-08-14 | |||
| JPS5463140A | 1979-05-21 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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