Title:
PRESSURE SENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2005/073333
Kind Code:
A1
Abstract:
A pressure sensitive adhesive composition which comprises (A) an oxyalkylene based polymer which contains 0.3 to 0.7 equivalent of a hydrolyzable silyl group in one molecule thereof and has a number average molecular weight of 15,000 to 100,000 (a polymer containing a hydrolyzable silyl group), (B) a tackifier resin and (C) a curing catalyst. The above pressure sensitive adhesive composition can be applied in a state wherein completely or almost no organic solvent is contained and also exhibits excellent adhesive characteristics.
Inventors:
FUJIMOTO KAZUHIDE (JP)
UEDA KAZUHIKO (JP)
UEDA KAZUHIKO (JP)
Application Number:
PCT/JP2005/001025
Publication Date:
August 11, 2005
Filing Date:
January 26, 2005
Export Citation:
Assignee:
KANEKA CORP (JP)
FUJIMOTO KAZUHIDE (JP)
UEDA KAZUHIKO (JP)
FUJIMOTO KAZUHIDE (JP)
UEDA KAZUHIKO (JP)
International Classes:
C08G65/336; C09J7/38; C09J11/06; C09J171/00; C09J201/10; (IPC1-7): C09J171/00; C09J201/10; C09J11/06
Foreign References:
| JPH02132174A | 1990-05-21 | |||
| JPS6035069A | 1985-02-22 | |||
| JPS5971377A | 1984-04-23 | |||
| JPS61116327A | 1986-06-03 | |||
| JP2003105303A | 2003-04-09 | |||
| JP2004115780A | 2004-04-15 |
Other References:
See also references of EP 1715015A4
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-sh, Osaka 88, JP)
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