Title:
PRESSURE SENSITIVE ADHESIVE LAYER FOR CLEANING, PROCESS FOR PRODUCING THE SAME, CLEANING SHEET, DELIVERY MEMBER WITH CLEANING FUNCTION, AND METHOD OF CLEANING OFF FOREIGN MATTER
Document Type and Number:
WIPO Patent Application WO/2007/123116
Kind Code:
A1
Abstract:
A pressure sensitive adhesive layer for cleaning that excels in both of the capabilities
of delivery within substrate treating apparatus and removal of foreign matter
adhering in the apparatus and thus is suitable for use in a cleaning sheet; a process
for producing the same; a cleaning sheet; a delivery member with cleaning function;
and a method of cleaning off foreign matter. There is provided a pressure sensitive
adhesive layer for cleaning having a planar surface and used to remove any foreign
matter from a treatment object, the layer consisting of a product of hardening
of a radiating hardening or thermosetting acrylic pressure sensitive adhesive
containing an acrylic polymer, characterized in that the surface of the pressure
sensitive adhesive layer has discontinuous open depressions, and that the average
diameter of openings is smaller than the average size of foreign matter.
Inventors:
MURATA AKIHISA (JP)
YAMAMOTO TAKAYUKI (JP)
KANADA MITSUHIRO (JP)
MIZUTANI KAORI (JP)
YASUDA HIRONORI (JP)
YAMAMOTO TAKAYUKI (JP)
KANADA MITSUHIRO (JP)
MIZUTANI KAORI (JP)
YASUDA HIRONORI (JP)
Application Number:
PCT/JP2007/058335
Publication Date:
November 01, 2007
Filing Date:
April 17, 2007
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
MURATA AKIHISA (JP)
YAMAMOTO TAKAYUKI (JP)
KANADA MITSUHIRO (JP)
MIZUTANI KAORI (JP)
YASUDA HIRONORI (JP)
MURATA AKIHISA (JP)
YAMAMOTO TAKAYUKI (JP)
KANADA MITSUHIRO (JP)
MIZUTANI KAORI (JP)
YASUDA HIRONORI (JP)
International Classes:
C09J7/02; B08B1/00; C09J4/00; C09J133/00; H01L21/304
Foreign References:
| JP2007002225A | 2007-01-11 | |||
| JP2005268483A | 2005-09-29 | |||
| JP2005286261A | 2005-10-13 | |||
| JPH09283605A | 1997-10-31 |
Attorney, Agent or Firm:
OZAKI, Yuzo et al. (13-9 Nishinakajima 5-chome,Yodogawa-ku, Osaka-shi, Osaka 11, JP)
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