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Title:
PRESSURE-SENSITIVE ADHESIVE MATERIAL AND PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/068009
Kind Code:
A1
Abstract:
Provided is a pressure-sensitive adhesive material having excellent pressure-sensitive adhesiveness, excellent flexibility, and excellent restorability.　The pressure-sensitive adhesive material is characterized by including a polymer (X) which has a crosslinked structure and having a 25°C shear storage modulus of 0.15 MPa or less, a glass transition temperature of 0°C or lower, and a gel content of 50-95 mass%, and by including a sol component giving a differential molecular-weight distribution curve which satisfies the following requirements: (1) the proportion (W1) of the area of peaks appearing at molecular weights of 10,000 and higher but less than 100,000 to the area of peaks appearing at molecular weights of 10,000-30,000,000 is 20% or less; (2) the proportion (W2) of the area of peaks appearing at molecular weights of 100,000 and higher but less than 560,000 to the area of peaks appearing at molecular weights of 10,000-30,000,000 is 40% or greater; and (3) the proportion (W3) of the area of peaks appearing at molecular weights of 560,000 and higher to the area of peaks appearing at molecular weights of 10,000-30,000,000 is 40% or less.

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Inventors:
YAMAMOTO KENTA (JP)
Application Number:
PCT/JP2022/036455
Publication Date:
April 27, 2023
Filing Date:
September 29, 2022
Export Citation:
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Assignee:
OTSUKA CHEMICAL CO LTD (JP)
HIGASHIYAMA FILM CO LTD (JP)
International Classes:
C09J201/00; C09J7/38; C09J133/04
Domestic Patent References:
WO2022181355A12022-09-01
WO2013183563A12013-12-12
WO2020095870A12020-05-14
WO2021049229A12021-03-18
WO2021172017A12021-09-02
WO2021111995A12021-06-10
Foreign References:
JP2022132137A2022-09-07
JP2011231189A2011-11-17
JP7108165B12022-07-28
Attorney, Agent or Firm:
FUTAKUCHI Osamu (JP)
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