Title:
PRESSURE-SENSITIVE-ADHESIVE PRECURSOR COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET, AND PROCESS FOR PRODUCING OPTICAL MEMBER
Document Type and Number:
WIPO Patent Application WO/2017/209257
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide a pressure-sensitive-adhesive precursor composition capable of providing a pressure-sensitive adhesive sheet which satisfies all of transparency, conformability to rugged portions, and unsusceptibility to bubble inclusion and has satisfactory processability.
In order to achieve such purpose, the present invention provides a pressure-sensitive-adhesive precursor composition characterized by comprising the following components (A) to (D), the component (A) being a polymer obtained by polymerizing a monomer ingredient comprising the following ingredient (a1) and
the component (B) comprising the following ingredient (b1).
(A) A (meth)acrylate polymer
(B) An ultraviolet-curable (meth)acrylate monomer
(C) A photopolymerization initiator
(D) A heat-curing crosslinking agent
(a1) A hydroxylated methacrylate monomer
(b1) A monomer having a structural oxyalkylene unit and having two or more (meth)acrylate groups in the molecule
Inventors:
HOTTA HAYATO (JP)
Application Number:
PCT/JP2017/020495
Publication Date:
December 07, 2017
Filing Date:
June 01, 2017
Export Citation:
Assignee:
LION SPECIALTY CHEMICALS CO LTD (JP)
International Classes:
C09J133/04; C09J4/02; C09J4/06; C09J7/00; C09J11/06; C09J133/10
Foreign References:
JP2015189938A | 2015-11-02 | |||
JP2015199813A | 2015-11-12 | |||
JP2014196451A | 2014-10-16 | |||
JP2014227453A | 2014-12-08 |
Attorney, Agent or Firm:
TSUJIMARU Koichiro et al. (JP)
Download PDF:
Previous Patent: SILICON COMPOUND-COATED METAL PARTICLES
Next Patent: ORGANIC COMPOUND REFINING METHOD
Next Patent: ORGANIC COMPOUND REFINING METHOD