Title:
PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD FOR REMOVING PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2024/024860
Kind Code:
A1
Abstract:
Provided is a pressure-sensitive adhesive sheet which is readily removable by heating and has satisfactory storage stability. The pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer comprises a polymer, a polyfunctional monomer, and a thermal polymerization initiator. The thermal polymerization initiator has a self-acceleration decomposition temperature (SADT) [°C] satisfying the relationship SADT+10≥60. The pressure-sensitive adhesive sheet has a decrease A [%] in peel force through heating of higher than 50% but less than 99.9%.
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Inventors:
KUMAKURA KENTA (JP)
HONDA SATOSHI (JP)
NAGAIDA MIYABI (JP)
HONDA SATOSHI (JP)
NAGAIDA MIYABI (JP)
Application Number:
PCT/JP2023/027453
Publication Date:
February 01, 2024
Filing Date:
July 26, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/38; C09J4/02; C09J11/06; C09J133/00
Domestic Patent References:
| WO2020162330A1 | 2020-08-13 |
Foreign References:
| JP2021095526A | 2021-06-24 | |||
| JP2003231867A | 2003-08-19 | |||
| JP2003231875A | 2003-08-19 | |||
| JP2007152869A | 2007-06-21 | |||
| JP2016204617A | 2016-12-08 |
Attorney, Agent or Firm:
OI, Michiko (JP)
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