Title:
PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2020/158351
Kind Code:
A1
Abstract:
This pressure-sensitive adhesive sheet 1 comprises: a substrate 2; and a pressure-sensitive adhesive layer 3 positioned on one surface of the substrate 2. The pressure-sensitive adhesive layer 3 comprises a polymerizable composition containing: a polymer; a photocuring agent having two or more polymerizable functional groups; and a photopolymerization initiator. The viscosity of the photocuring agent at 25°C is at least 100 mPa·s. The shear storage modulus G' of the pressure-sensitive adhesive layer 3 at 25°C after curing is at least 2.00×106 Pa.
Inventors:
NAKANO TAKESHI (JP)
KATAOKA KENICHI (JP)
KATAOKA KENICHI (JP)
Application Number:
PCT/JP2020/000710
Publication Date:
August 06, 2020
Filing Date:
January 10, 2020
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J4/02; C09J4/06; C09J7/38; C09J201/00
Domestic Patent References:
| WO2014050763A1 | 2014-04-03 |
Foreign References:
| JP2005332901A | 2005-12-02 | |||
| JP2006152141A | 2006-06-15 | |||
| JP2013165206A | 2013-08-22 | |||
| JP2017082104A | 2017-05-18 | |||
| JP2002053819A | 2002-02-19 | |||
| JP2011054940A | 2011-03-17 | |||
| JP2002203816A | 2002-07-19 | |||
| JP2004010829A | 2004-01-15 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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