Title:
PRESSURE-SENSITIVE-ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2021/065071
Kind Code:
A1
Abstract:
A pressure-sensitive-adhesive sheet in which the tensile strength FA1 when a first test piece having a width of 25 mm is produced from a pressure-sensitive-adhesive sheet (1) having a substrate (10) and a pressure-sensitive-adhesive layer (20), and the first test piece is pulled 0.5 mm by a tensile tester with the longitudinal ends of the first test piece gripped in clamping jaws (101, 102) thereof, and the tensile strength FB1 when a second test piece is produced by adhering a first semiconductor chip (CP1), from among a first semiconductor chip (CP1) and a second semiconductor chip (CP2) having a length dimension of 45 mm, a width dimension of 35 mm, and thickness dimension of 0.625 mm, at one longitudinal end of the first test piece and adhering the second semiconductor chip (CP2) at the other longitudinal end, and the second test piece is pulled 0.5 mm by a tensile tester with the longitudinal ends of the second test piece gripped in the clamping jaws (101, 102) satisfy the relationship in formula (1A). Formula (1A): FB1/FA1 ≤ 30.
Inventors:
YAMADA TADATOMO (JP)
TAKANO KEN (JP)
TAKYU SHINYA (JP)
TAKANO KEN (JP)
TAKYU SHINYA (JP)
Application Number:
PCT/JP2020/020328
Publication Date:
April 08, 2021
Filing Date:
May 22, 2020
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J133/00; C09J7/25; C09J7/38; H01L21/683
Domestic Patent References:
| WO2019172219A1 | 2019-09-12 | |||
| WO2018181511A1 | 2018-10-04 | |||
| WO2012124389A1 | 2012-09-20 | |||
| WO2019181732A1 | 2019-09-26 | |||
| WO2015133420A1 | 2015-09-11 | |||
| WO2015002270A1 | 2015-01-08 |
Foreign References:
| JP2018115331A | 2018-07-26 | |||
| JP2019131638A | 2019-08-08 | |||
| JP2018159014A | 2018-10-11 | |||
| JP2009138183A | 2009-06-25 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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