Title:
PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/153601
Kind Code:
A1
Abstract:
Provided is a pressure-sensitive adhesive sheet which is usable as a temporary fixer when encapsulating a semiconductor chip with a resin and which can prevent the encapsulating resin from having an appearance failure after the pressure-sensitive adhesive sheet has been removed therefrom. This pressure-sensitive adhesive sheet comprises a substrate and a pressure-sensitive adhesive layer disposed on at least one side of the substrate, wherein the pressure-sensitive adhesive layer comprises a pressure-sensitive adhesive, the pressure-sensitive adhesive including a base polymer having an Sp value of 19.5 (J/cm3)1/2 to 25 (J/cm3)1/2.
Inventors:
NAKAO KOTA (JP)
YUTOU TAKUMI (JP)
KATO KAZUMICHI (JP)
YUTOU TAKUMI (JP)
KATO KAZUMICHI (JP)
Application Number:
PCT/JP2021/034168
Publication Date:
July 21, 2022
Filing Date:
September 16, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J133/00; C09J7/38; C09J133/04; C09J201/00
Foreign References:
| JP2018193563A | 2018-12-06 | |||
| JP2008274153A | 2008-11-13 | |||
| JP2001308116A | 2001-11-02 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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