Title:
PRESSURE-SENSITIVE ADHESIVE AND PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/153152
Kind Code:
A1
Abstract:
Provided are: a pressure-sensitive adhesive that contains an emulsion type polymer, an active energy ray-curable resin and, preferably, a photopolymerization initiator; and a pressure-sensitive adhesive sheet 1 that is constituted of a pressure-sensitive adhesive layer 11 comprising said pressure-sensitive adhesive. The emulsion type polymer is preferably an acrylic polymer, and the active energy ray-curable resin is preferably an emulsion type resin. The gel fraction in the pressure-sensitive adhesive after being cured with active energy rays is preferably 60-99%. The pressure-sensitive adhesive sheet 1 makes it possible to achieve both cohesive strength and adhesive properties.
Inventors:
NANASHIMA YUTAKA (JP)
ASAINA SHOHEI (JP)
ASAINA SHOHEI (JP)
Application Number:
PCT/JP2023/001242
Publication Date:
August 17, 2023
Filing Date:
January 18, 2023
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J201/00; C09J4/02; C09J7/38; C09J11/06; C09J133/00
Foreign References:
| JPS61103908A | 1986-05-22 | |||
| JP2012229375A | 2012-11-22 | |||
| JPH01272676A | 1989-10-31 | |||
| JP2004346296A | 2004-12-09 | |||
| JP2012001615A | 2012-01-05 | |||
| JP2003171622A | 2003-06-20 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
Download PDF: