Title:
PRESSURE-SENSITIVE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2021/153619
Kind Code:
A1
Abstract:
This pressure-sensitive adhesive tape includes a pressure-sensitive adhesive layer comprising a photocuring type acrylic resin, a metal having a less noble potential than iron, and an electroconductive material excluding the metal, wherein the pressure-sensitive adhesive layer has a total light transmittance X per 1-μm thickness of 99.85% or less and has a total light transmittance Y of 6% or higher. According to the present invention, it is possible to provide a pressure-sensitive adhesive tape which is excellent in terms of the adhesive force of both the front and back surfaces and which has satisfactory sacrificial anticorrosive properties.
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| WO/2014/007353 | PRESSURE-SENSITIVE ADHESIVE SHEET |
| JP4901976 | Bonding agent |
| WO/2015/104988 | CONDUCTIVE FILM-LIKE ADHESIVE AND DICING TAPE WITH FILM-LIKE ADHESIVE |
Inventors:
KAJI SHOUJI (JP)
SAKON TAKAAKI (JP)
SASAKI TAKU (JP)
SAKON TAKAAKI (JP)
SASAKI TAKU (JP)
Application Number:
PCT/JP2021/002853
Publication Date:
August 05, 2021
Filing Date:
January 27, 2021
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J9/02; C09J7/10; C09J7/38; C09J11/04; C09J133/04; C09J201/00
Foreign References:
| JP2019127606A | 2019-08-01 | |||
| JP2014114377A | 2014-06-26 | |||
| JP2012021124A | 2012-02-02 | |||
| JPH09228079A | 1997-09-02 |
Other References:
See also references of EP 4098711A4
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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