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Title:
PRESSURE-SENSITIVE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2022/092149
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a pressure-sensitive adhesive tape that not only has exceptional flexibility and impact resistance but also imposes a low environmental load. The present invention is a pressure-sensitive adhesive tape having a foam substrate and at least one pressure-sensitive adhesive layer, wherein the foam substrate contains a block copolymer having blocks derived from (meth)acrylic-based monomers, and the pressure-sensitive adhesive tape contains biologically derived carbon.

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Inventors:
UCHIDA NORIYUKI (JP)
ISHIDO YASUSHI (JP)
FUKUYAMA MAKOTO (JP)
NISHIGAKI TATSUYA (JP)
HORIO AKIFUMI (JP)
YASUDA HINA (JP)
Application Number:
PCT/JP2021/039651
Publication Date:
May 05, 2022
Filing Date:
October 27, 2021
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
B32B5/18; B32B27/00; C09J7/26; C09J201/00
Domestic Patent References:
WO2019244595A12019-12-26
WO2020218430A12020-10-29
Foreign References:
KR20190036190A2019-04-04
JP2018172592A2018-11-08
JP2016008290A2016-01-18
JP2018193558A2018-12-06
JP2015199923A2015-11-12
JP2016145339A2016-08-12
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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