PRESSURE-SENSITIVE SILICONE ADHESIVE COMPOSITION

Title:

PRESSURE-SENSITIVE SILICONE ADHESIVE COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2021/171734

Kind Code:

A1

Abstract:

This pressure-sensitive silicone adhesive composition comprises (A) an organopolysiloxane having two or more alkenyl-group-containing organic groups in the molecule and containing alkenyl groups in an amount of 0.0002-0.05 mol per 100 g of the organopolysiloxane, (B) a polyorganosiloxane comprising an R2 3SiO1/2 unit and an SiO4/2 unit, the (R2 3SiO1/2 unit)/(SiO4/2 unit) molar ratio being 0.6-1.0, (C) a polyorganohydrogensiloxane represented by R3 eHfSiO(4-e-f)/2 and having three or more Si-H groups in the molecule, (D) a platinum-group metal catalyst for curing the composition by causing the alkenyl groups of the composition to undergo hydrosilylation addition with the Si-H groups of the (C) ingredient, and (E) a silicon-free thermoplastic resin. Due to this, provided is a pressure-sensitive silicone adhesive composition which has controlled tackiness due to the addition of an ingredient which is not a silicone resin and which combines high adhesive force with high tack.

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Inventors:

TSUCHIDA OSAMU (JP)

Application Number:

PCT/JP2020/045947

Publication Date:

September 02, 2021

Filing Date:

December 10, 2020

Export Citation:

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Assignee:

SHINETSU CHEMICAL CO (JP)

International Classes:

C09J11/08; C09J7/30; C09J7/38; C09J183/05; C09J183/07; C09J201/00

Domestic Patent References:

WO2006134997A1	2006-12-21
WO2005033239A1	2005-04-14

Foreign References:

JP2014047310A	2014-03-17
JPH10158595A	1998-06-16
CN110713816A	2020-01-21
JP2011102336A	2011-05-26
JP2015178584A	2015-10-08
CN109837057A	2019-06-04
JP2000169814A	2000-06-20
JPH05209164A	1993-08-20