Title:
PRESSURE SENSOR, AND DISPENSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/079883
Kind Code:
A1
Abstract:
The objective of the present invention is to provide a pressure sensor having an improved effect of suppressing peeling of a pressure accepting portion such as a diaphragm. A pressure sensor 15 according to the present invention comprises a sensor enclosure 32 in which a first flow passage 33 and a second flow passage 35 that branches from the first flow passage 33 are formed, a sensor chip 31 which includes a diaphragm portion 31a provided so as to block the second flow passage 35, and which is joined to the sensor enclosure 32, a cap member 34 installed on the sensor chip 31 so as to cover the diaphragm portion 31a from the opposite side to the sensor enclosure 32, and a pressing member 60 for pressing the cap member 34 toward the sensor chip 31, wherein an inner circumference of a part of the cap member 34 that is placed on the sensor chip 31 is disposed so as to be positioned further toward the center of the diaphragm portion 31a than an inner circumference of a joint portion 36 of the sensor enclosure 32 and the sensor chip 31.
Inventors:
YAMASAKI TATSUYA (JP)
KANAMARU MASATOSHI (JP)
AONO TAKANORI (JP)
SUZUKI YOHICHIROH (JP)
TAKAHASHI TAKUYA (JP)
IKEDA HIROSHI (JP)
KANAMARU MASATOSHI (JP)
AONO TAKANORI (JP)
SUZUKI YOHICHIROH (JP)
TAKAHASHI TAKUYA (JP)
IKEDA HIROSHI (JP)
Application Number:
PCT/JP2022/036986
Publication Date:
May 11, 2023
Filing Date:
October 03, 2022
Export Citation:
Assignee:
HITACHI HIGH TECH CORP (JP)
International Classes:
G01L9/00
Foreign References:
| JP2009265041A | 2009-11-12 | |||
| JP2006010539A | 2006-01-12 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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