Title:
PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2017/122496
Kind Code:
A1
Abstract:
This pressure sensor (100) is characterized by having: a diaphragm (3); a semiconductor chip (1) having a square shape in a plan view and having a plurality of resistors (R1-R4) constituting a strain gauge; four first structures (2a-2d) each having one end joined to a region of a second main surface (3B) of the diaphragm, the region deforming when pressure is applied to a first main surface (1A) of the diaphragm, the four first structures (2a-2d) also having the other ends respectively connected to the four corners of the semiconductor chip, the four first structures (2a-2d) being extended downward to the second main surface; and a second structure (2e) having one end joined to the second main surface at the center (30) of the diaphragm in the plan view, the second structure (2e) also having the other end joined to the center (10) of the semiconductor chip in the plan view and extended downward to the second main surface.
Inventors:
SETO YUKI (JP)
OGASAWARA RINA (JP)
OGASAWARA RINA (JP)
Application Number:
PCT/JP2016/087556
Publication Date:
July 20, 2017
Filing Date:
December 16, 2016
Export Citation:
Assignee:
AZBIL CORP (JP)
International Classes:
G01L9/00
Foreign References:
| JP2008527313A | 2008-07-24 | |||
| JPH09232595A | 1997-09-05 | |||
| JP2009236666A | 2009-10-15 | |||
| JP2001272287A | 2001-10-05 |
Attorney, Agent or Firm:
YAMAKAWA,Shigeki et al. (JP)
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