PRESSURIZATION DEVICE AND PRESSURIZATION METHOD

Title:

PRESSURIZATION DEVICE AND PRESSURIZATION METHOD

Document Type and Number:

WIPO Patent Application WO/2014/111974

Kind Code:

A1

Abstract:

To obtain a pressurization device that can correctly apply pressure to the entire surface of a workpiece, and a pressure problem. A pressurization device (1) is provided with a table (2) provided with a workpiece mounting surface (21), a pressurization head (3) facing the workpiece mounting surface (21), a main pressurization shaft (4) that applies pressure to the center of the pressurization head (3), a plurality of sub-pressurization shafts (5) that apply pressure to the pressurization head (3) around the main pressurization shaft (4), and a control unit (6) that controls conditions of pressures applied by the main pressurization shaft (4) and by the plurality of sub-pressurization shafts (5). Although large loads are applied to the center of a workpiece (10) and small loads are applied to the end parts of the workpiece (10) when the main pressurization shaft (4) applies pressure to the center of the pressurization head (3) from the rear surface side, the loads can be optimally balanced in the center and in the end parts of the workpiece (10) because the plurality of sub-pressurization shafts (5) apply pressure from the rear surface side to the pressurization head (3) around the main pressurization shaft (4).

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Inventors:

NISHIZAWA KUNIJI (JP)
FUJIMORI TAKAYUKI (JP)
MIKOSHIBA ATSUSHI (JP)

Application Number:

PCT/JP2013/000236

Publication Date:

July 24, 2014

Filing Date:

January 18, 2013

Export Citation:

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Assignee:

OKAYA HEAT TREATING CORP (JP)

International Classes:

B21D1/06; B30B1/34; B30B15/22

Foreign References:

JPH08132300A	1996-05-28
JPS6356607U	1988-04-15
JP2012166263A	2012-09-06
JP2007203304A	2007-08-16
JP2000343287A	2000-12-12