Title:
PRIMER COMPOSITION, BONDING METHOD, AND ELECTRIC/ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2016/136244
Kind Code:
A1
Abstract:
The primer composition according to the present invention comprises at least (A) an organosiloxane block copolymer represented by the average unit formula: (R1
2SiO2/2)a(R2SiO3/2)b, having resin-type siloxane blocks connected by linear siloxane blocks, and comprising 0.5-35.0 mol% of silicon atom-binding hydroxyl groups or silicon atom-binding alkoxy groups (in the formula, R1 and R2 each independently represents an alkyl group having 1-12 carbon atoms, an aryl group having 6-20 carbon atoms or an aralkyl group having 7-20 carbon atoms, a represents a number in the range 0.40-0.90, b represents a number in the range 0.10-0.60, and a + b = 1.00); (B) a curing catalyst; and (C) an organic solvent. The primer composition according to the present invention improves the adhesion of cured silicones to base materials of optical semiconductor elements, package materials, substrates and the like, and can suppress peeling or cracking of the cured silicones caused by heat cycles.
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Inventors:
YAMAZAKI RYOSUKE (JP)
YOSHIDA HIROAKI (JP)
YOSHIDA SHIN (JP)
YOSHIDA HIROAKI (JP)
YOSHIDA SHIN (JP)
Application Number:
PCT/JP2016/000960
Publication Date:
September 01, 2016
Filing Date:
February 23, 2016
Export Citation:
Assignee:
DOW CORNING TORAY CO LTD (JP)
International Classes:
C09D183/10; C09D5/00; C09D7/12
Domestic Patent References:
| WO2014129347A1 | 2014-08-28 |
Foreign References:
| JP2014510802A | 2014-05-01 | |||
| JP2004075970A | 2004-03-11 |
Other References:
See also references of EP 3275955A4
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