Title:
PRIMER COMPOSITION FOR PRESSURE-SENSITIVE SILICONE ADHESIVE, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2018/190047
Kind Code:
A1
Abstract:
A primer composition for pressure-sensitive silicone adhesives which comprises
(A) an organopolysiloxane including at least two alkenyl-containing organic groups in the molecule and having an alkenyl group content of 0.001-0.008 mol per 100 g of the organopolysiloxane,
(B) an organopolysiloxane including at least two alkenyl-containing organic groups in the molecule and having an alkenyl group content of 0.15-1.3 mol per 100 g of the organopolysiloxane,
(C) an organohydrogenpolysiloxane having at least three Si-H groups in the molecule but containing neither any alkoxy group nor any epoxy group, and
(D) a platinum-group metal catalyst. The primer composition cures satisfactorily while sufficiently exhibiting adhesiveness to pressure-sensitive silicone adhesives. Even after having cured sufficiently, the primer composition can retain the satisfactory adhesiveness.
Inventors:
TSUCHIDA OSAMU (JP)
AOKI SHUNJI (JP)
AOKI SHUNJI (JP)
Application Number:
PCT/JP2018/009201
Publication Date:
October 18, 2018
Filing Date:
March 09, 2018
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C09D183/07; C09D5/00; C09D7/40; C09D183/05; C09J7/20; C09J183/04
Foreign References:
| JP2008274251A | 2008-11-13 | |||
| JP2002338890A | 2002-11-27 | |||
| JP2010184953A | 2010-08-26 | |||
| JP2012149240A | 2012-08-09 | |||
| JP2013139509A | 2013-07-18 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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