Title:
PRINTED CIRCUIT BOARD ASSEMBLY WITH IMPROVED THERMAL PERFORMANCE
Document Type and Number:
WIPO Patent Application WO2001069987
Kind Code:
A3
Abstract:
A printed circuit board assembly comprises a printed circuit board and a heat sink that has two surface planes. One surface plane of the heat sink is raised, and provides a surface area for contact with the printed circuit board. The other surface plane is lower than the raised surface plane. The printed circuit board extends over the lower surface plane. The distance between the raised surface plane and the lower surface plane provides space for through-hole pins that extend beneath the printed circuit board, because the underside of the printed circuit board lies on the raised surface plane. The multi-plane heat sink can be formed by an extrusion process, as well as a stamping or other process that allows for more complex patterns of surfaces.
Inventors:
MATTAS CHUCK
Application Number:
PCT/EP2001/002534
Publication Date:
February 21, 2002
Filing Date:
March 06, 2001
Export Citation:
Assignee:
KONINKL PHILIPS ELECTRONICS NV (NL)
International Classes:
H05K1/02; F21V23/02; H05K3/00; H05K7/20; H05K3/34; (IPC1-7): H05K7/20
Foreign References:
| EP0489958A1 | 1992-06-17 | |||
| EP0917417A2 | 1999-05-19 | |||
| US5172301A | 1992-12-15 | |||
| US3825803A | 1974-07-23 |
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