PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

WIPO Patent Application WO/2023/272677

A1

Embodiments of the present application provide a printed circuit board, comprising a core plate and a substrate. The core plate is coveringly provided on an outer wall surface of the substrate. The core plate comprises a first conductive layer, a second conductive layer and a first dielectric layer. The first conductive layer is located on the side of the core plate away from the substrate. The second conductive layer is located on the side of the core plate close to the substrate. The first dielectric layer is located between the first conductive layer and the second conductive layer, and comprises a soft dielectric layer having a Young's modulus less than or equal to a preset Young's modulus. For the printed circuit board provided in the embodiments of the present application, in one aspect, the modulus of the PCB at the bottom of a solder joint of a power device is reduced, thereby increasing the reliability of the solder joint between the power device and the PCB to meet the requirements for product service life. In another aspect, the voltage-withstanding capability between the outermost conductive layer and the conductive layer thereunder is enhanced.

TAO WEI (CN)
JIN YUPENG (CN)
SANG YALEI (CN)
CHEN ZHENYU (CN)
ZAIMURAN WUSIMAN (CN)

PCT/CN2021/103976

January 05, 2023

July 01, 2021

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HUAWEI TECH CO LTD (CN)

H05K1/02

CN104602448A	2015-05-06
CN207491300U	2018-06-12
CN101038881A	2007-09-19
TWM320824U	2007-10-11

E-TONE INTELLECTUAL PROPERTY FIRM (GENERAL PARTNERSHIP) (CN)

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