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Title:
PRINTED CIRCUIT BOARD AND METHOD FOR PREPARING SAME
Document Type and Number:
WIPO Patent Application WO/2018/130229
Kind Code:
A1
Abstract:
Disclosed are a printed circuit board and a method for preparing the printed circuit board, wherein the printed circuit board comprises a circuit board body comprising a plurality of sub-boards arranged one on another, wherein a first surface of the circuit board body is provided with a recessed trough therein, and at least one plated-through-hole with a metal hole ring is arranged at the bottom of the recessed trough.

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Inventors:
WEI XINQI (CN)
YAN LING (CN)
WANG YU (CN)
YANG SHANMING (CN)
DONG XIANHUI (CN)
WU YOUGUI (CN)
Application Number:
PCT/CN2018/072875
Publication Date:
July 19, 2018
Filing Date:
January 16, 2018
Export Citation:
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Assignee:
ZTE CORP (CN)
International Classes:
H05K3/46; H05K1/02
Foreign References:
CN104902684A2015-09-09
CN105722302A2016-06-29
CN104902701A2015-09-09
CN104602464A2015-05-06
CN102946691A2013-02-27
US20020020554A12002-02-21
Attorney, Agent or Firm:
AFD CHINA INTELLECTUAL PROPERTY LAW OFFICE (CN)
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