Title:
PRINTED WIRING BOARD AND COIL DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/127414
Kind Code:
A1
Abstract:
This printed wiring board comprises: a base film having a first main surface and a second main surface; first wiring disposed on the first main surface; and second wiring disposed on the second main surface. The base film has a first section and a second section. The first section and the second section are arranged along a first direction, which is the longitudinal direction of the base film in a plan view. A first boundary, which is the boundary between the first section and the second section, is along a second direction orthogonal to the first direction in a plan view. The first wiring has a first coil part positioned in the first section and wound in a spiral shape in a plan view, and a second coil part positioned in the second section and wound in a spiral shape in a plan view. When the base film is curved along the first boundary such that the first coil part overlaps with the second coil part in a plan view, the first section is disposed so as to partially overlap the second section in a plan view.
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| JP2010183042 | WIRING SUBSTRATE |
Inventors:
MIYABARA MASAKI (JP)
NOGUCHI KOU (JP)
NOGUCHI KOU (JP)
Application Number:
PCT/JP2022/044755
Publication Date:
July 06, 2023
Filing Date:
December 05, 2022
Export Citation:
Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K1/02; H01F17/00; H05K1/16
Foreign References:
| JP2021019014A | 2021-02-15 | |||
| JPS58124918U | 1983-08-25 | |||
| JP2020181852A | 2020-11-05 | |||
| JP2011192710A | 2011-09-29 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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