Title:
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/107116
Kind Code:
A1
Abstract:
A printed wiring board of the present disclosure is provided with a multilayer substrate including: a core substrate having a first surface and a second surface; a first build-up layer positioned on the first surface of the core substrate; and a second build-up layer positioned on the second surface of the core substrate. The multilayer substrate includes a cavity, a first conductor layer, and a second conductor layer. The cavity penetrates through the first build-up layer and the core substrate, and has a bottom surface which is a surface of the second build-up layer. The first conductor layer is positioned at the bottom surface of the cavity. The second conductor layer is positioned in the second build-up layer, and is positioned to overlap at least a part of a peripheral portion of the bottom surface of the cavity in a plan perspective.
Inventors:
KAWAGOE ATSUO (JP)
Application Number:
PCT/JP2020/044278
Publication Date:
June 03, 2021
Filing Date:
November 27, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K3/46
Domestic Patent References:
| WO2010050627A1 | 2010-05-06 | |||
| WO2014125852A1 | 2014-08-21 |
Foreign References:
| JP2019046860A | 2019-03-22 | |||
| JP2012060056A | 2012-03-22 | |||
| JP2019121766A | 2019-07-22 | |||
| JP2005158887A | 2005-06-16 | |||
| JP2018200952A | 2018-12-20 |
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, P.C. (JP)
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