Title:
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/200538
Kind Code:
A1
Abstract:
A printed wiring board (1) is provided with an insulating layer (200) and a conductor portion (100). The insulating layer (200) has an opening portion (3) in a direction perpendicular to a first surface (S1) of the insulating layer. The conductor portion (100) includes a connecting conductor (122) in at least a part of the opening portion. The opening portion (3) has an inner wall surface (3a) having a first recess portion (30) including a part of the connecting conductor. The first recess portion has an inner wall surface (30a) having a second recess portion (300) including a part of the connecting conductor.
Inventors:
MATSUMOTO KEISAKU (JP)
Application Number:
PCT/JP2021/012542
Publication Date:
October 07, 2021
Filing Date:
March 25, 2021
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K3/42
Foreign References:
| JPH05235544A | 1993-09-10 | |||
| JP2008159818A | 2008-07-10 | |||
| JP2007158238A | 2007-06-21 | |||
| JP2017135357A | 2017-08-03 |
Other References:
See also references of EP 4132236A4
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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