Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2024/048713
Kind Code:
A1
Abstract:
Provided are: a printed wiring board having a via conductor which is not easily extracted from an insulating layer; and a method for manufacturing the same.　The printed wiring board comprises a core substrate and a buildup layer stacked on the core substrate. The buildup layer has an insulating layer stacked on the core substrate, a hole passing through the insulating layer in the thickness direction of the insulating layer, and a via conductor filled in the hole. The shape of the via conductor is cylindrical.

Inventors:
SAEKI SHINRI (JP)
ISHIOKA TAKASHI (JP)
Application Number:
PCT/JP2023/031794
Publication Date:
March 07, 2024
Filing Date:
August 31, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K3/46
Domestic Patent References:
WO2010024233A12010-03-04
WO2011089795A12011-07-28
Foreign References:
JP2009260204A2009-11-05
JP2014075523A2014-04-24
JP2004337948A2004-12-02
Attorney, Agent or Firm:
ARAFUNE Hiroshi et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ARTICLE, CROSSLINKED THERMOPLASTIC ELASTOMER COMPOSITION, AND METHOD FOR PRODUCING SAME

Next Patent: METHOD FOR PRODUCING 6-(4,4-DIMETHYLCYCLOHEXYL)-4-[(1,1-DIOXO-1λ6-THIOMORPHOLIN-4-YL)METHYL]-2-METH...