PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

WIPO Patent Application WO/2011/018968

A1

Disclosed is a method for producing a high-density printed wiring board having a surface on which a high-precision and ultrafine copper circuit pattern is formed, which is comprised of (a) a process for forming a resist pattern (5) which is formed by selectively exposing and developing a photosensitive resist film formed on the substrate surface, to form a groove pattern for a circuit forming portion and which can be plated by electroless copper plating, (b) a process for forming a copper plating layer (7) which covers the resist pattern by plating an exposed surface of the groove pattern portion of a substrate and the entire surface of the patterned resist film by electroless copper plating and, thereafter, plating the surfaces by electrolytic copper plating until the surfaces are substantially flattened and smoothed, and (c) a process for exposing a copper circuit pattern (8) on the surface by mechanically grinding and/or chemically grinding or etching the copper plating layer to evenly reduce the copper plating layer until the surface of the resist film is exposed. It is preferable that the pattern-formed resist film is irradiated with ultraviolet rays, heat-treated and/or plasma-treated.

ARIMA MASAO (JP)
IWAYAMA GENTO (JP)
ITO KEIICHI (JP)
TAKEUCHI TAKAFUMI (JP)

PCT/JP2010/063177

February 17, 2011

August 04, 2010

Click for automatic bibliography generation  

TAIYO INK MFG CO LTD (JP)
ARIMA MASAO (JP)
IWAYAMA GENTO (JP)
ITO KEIICHI (JP)
TAKEUCHI TAKAFUMI (JP)

H05K3/22; H05K3/18; H05K3/26; H05K3/38; H05K3/46

JP2001267724A	2001-09-28
JP2009512176A	2009-03-19
JP2002314208A	2002-10-25

Shigeki Yoshida (JP)
YOSHIDA, SHIGEKI (JP)

View/Download PDF      PDF Help

Previous Patent: OPTICAL UNIT AND METHOD FOR MANUFACTURING SAME

Next Patent: ANTENNA AND ANTENNA PRODUCTION METHOD