Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2018/021148
Kind Code:
A1
Abstract:
This printed wiring board comprises a power supply layer and a ground layer. A power supply layer pattern formed in the power supply layer includes: a branch which is a direct-current power feeding path connecting adjacent EBG unit cells; and a power supply layer electrode. A capacitive coupling element including a capacitive coupling element body is arranged in opposition to the power supply layer electrode with a layer provided therebetween. Either: the power supply layer pattern further includes a power supply layer wiring line that is formed so as to extend from the power supply layer electrode and surround at least a portion of the periphery of the electrode; the capacitive coupling element further includes a capacitive coupling element wiring line that is formed so as to extend from the capacitive coupling element body and surround at least a portion of the periphery of the body; or the power supply layer pattern further includes the power supply layer wiring line and the capacitive coupling element further includes the capacitive coupling element wiring line. The power supply layer pattern and the capacitive coupling element form an EBG structure in which EBG unit cells are arranged at regular intervals, the EBG unit cells being connected to the power supply layer wiring line and/or the capacitive coupling element wiring line and connected through a via.
Inventors:
TOYOTA YOSHITAKA (JP)
IOKIBE KENGO (JP)
LIN XINGXIAOYU (JP)
KANEKO TOSHIYUKI (JP)
NAITO MASANORI (JP)
UEHARA TOSHIHISA (JP)
IOKIBE KENGO (JP)
LIN XINGXIAOYU (JP)
KANEKO TOSHIYUKI (JP)
NAITO MASANORI (JP)
UEHARA TOSHIHISA (JP)
Application Number:
PCT/JP2017/026326
Publication Date:
February 01, 2018
Filing Date:
July 20, 2017
Export Citation:
Assignee:
NAT UNIV CORPORATION OKAYAMA UNIV (JP)
KYOCERA CORP (JP)
KYOCERA CORP (JP)
International Classes:
H05K3/46; H05K1/02
Foreign References:
| JP2013232613A | 2013-11-14 | |||
| JP2008131509A | 2008-06-05 |
Attorney, Agent or Firm:
FUKAI, Toshikazu (JP)
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