Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2018/021150
Kind Code:
A1
Abstract:
This printed wiring board comprises a power supply layer and a ground layer. A power supply layer pattern formed in a portion of the power supply layer includes: a branch which is a direct-current power feeding path connecting adjacent EBG unit cells; and a power supply layer electrode that is connected through a slit provided along the branch. A capacitive coupling element arranged in opposition to the power supply layer electrode with a layer provided therebetween has a structure in which EBG unit cells are arranged at regular intervals, the EBG unit cells being connected to the branch in the power supply layer pattern through a via.
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Inventors:
TOYOTA YOSHITAKA (JP)
IOKIBE KENGO (JP)
LIN XINGXIAOYU (JP)
KANEKO TOSHIYUKI (JP)
NAITO MASANORI (JP)
UEHARA TOSHIHISA (JP)
IOKIBE KENGO (JP)
LIN XINGXIAOYU (JP)
KANEKO TOSHIYUKI (JP)
NAITO MASANORI (JP)
UEHARA TOSHIHISA (JP)
Application Number:
PCT/JP2017/026331
Publication Date:
February 01, 2018
Filing Date:
July 20, 2017
Export Citation:
Assignee:
NAT UNIV CORPORATION OKAYAMA UNIV (JP)
KYOCERA CORP (JP)
KYOCERA CORP (JP)
International Classes:
H05K1/02; H05K3/46
Foreign References:
| JP2013232613A | 2013-11-14 | |||
| JP2008131509A | 2008-06-05 |
Attorney, Agent or Firm:
FUKAI, Toshikazu (JP)
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