Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/008531
Kind Code:
A1
Abstract:
A printed wiring board according to one aspect of the present disclosure comprises a substrate and a wiring layer disposed on the substrate and including a spiral wire forming a planar coil. If one orientation in the winding direction of the wiring as a whole in plan view is defined as a positive orientation, the wiring layer includes a first portion for reducing the density of current flow in the positive orientation.
Inventors:
NOGUCHI KOU (JP)
MORITA SEIJI (JP)
SHIMAOKA RYOU (JP)
MORITA SEIJI (JP)
SHIMAOKA RYOU (JP)
Application Number:
PCT/JP2022/029140
Publication Date:
February 02, 2023
Filing Date:
July 28, 2022
Export Citation:
Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K1/16; H01F17/00
Foreign References:
| JP2005347723A | 2005-12-15 | |||
| JP2009117546A | 2009-05-28 | |||
| JP2001052927A | 2001-02-23 |
Attorney, Agent or Firm:
IKEDA Yoshinori (JP)
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